Chiplets Semiconductor IP News & Insights

TSMC looks to standardise chiplet protocols in "world changing" move

TSMC is looking to develop a standard data format for chiplet designs that would be used by all the EDA design tool and assembly and test providers.

Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet

Tenstorrent, a company that sells AI processors and licenses AI and RISC-V IP, announced today that it selected Samsung Foundry to bring Tenstorrent’s...

How the Worlds of Chiplets and Packaging Intertwine

Chiplets mark a new era of semiconductor innovation, and packaging is an intrinsic part of this ambitious design undertaking. However, while chiplet...

Off-the-Shelf Chiplets Open New Market Opportunities

With the reintroduction of semiconductor integration into system development, standards-based chiplets promise more efficient, cost-effective designs.

Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets

With an unique interposer manufacturing service for chiplets connection and close collaboration with top-tier foundry and OSAT suppliers to secure...

Deploying Chiplets into Mass Markets

Chiplets are being universally used in highest performance SOC, ASICs and ASSP devices by large integrated Semiconductor companies to reduce costs...

FPGA Chiplets Get a Power and Cost Makeover Thanks to New Partnership

QuickLogic and YorChip Partner to Develop Low-Power, Low-Cost UCIe FPGA Chiplets

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) IP, ruggedized FPGAs and Endpoint AI/ML solutions, and YorChip, a pioneering...

Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era

Eliyan Corporation, an innovator in the field of efficient chiplet interconnect, announced its support for and compatibility with the new UCIe™ (Universal...

UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification

Today, the UCIe Consortium announced the public release of UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification to deliver valuable...

A methodology for turning an SoC into chiplets

Siemens has developed a workflow methodology for homogeneous disaggregation of SoCs into chiplets using hierarchical device planning.

YorChip launches UniPHY™ - the first dual-use PHY for Chiplets

YorChip, Inc. today launched its patent pending UniPHY™️ dual-use PHY which enables developers to support both traditional Chiplet substrate-based...