How the Worlds of Chiplets and Packaging Intertwine
By Majeed Ahmad, EETimes (September 26, 2023)
Chiplets mark a new era of semiconductor innovation, and packaging is an intrinsic part of this ambitious design undertaking. However, while chiplet and packaging technologies work hand in hand to redefine the possibilities of chip integration, this technological tie-up isn’t that simple and straightforward.
In chip packaging, the bare chip die is encapsulated in a supporting case with electrical contacts. The case protects the bare die from physical harm and corrosion and connects the chip to a PCB. This form of chip packaging has existed for decades.
To read the full article, click here
Related Semiconductor IP
- UCIe IP Core
- UCIe 3.0 Verification IP
- Verification IP for UCIe
- UCIe Verification IP
- AXI to UCIe Bridge IP
Related News
- Mythic Acquires Videantis, One of Europe’s Leading Digital Processor IP Companies, to Build the World’s Most Energy-Efficient AI Compute Platform
- NVIDIA Expands NVIDIA Agent Toolkit With NVIDIA PhysicsNeMo and CUDA-X Libraries to Transform How the World Engineers, Designs and Builds
- proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
- GlobalFoundries and RAAAM Memory Technologies announce the joint development of next-generation GCRAM technology and test chip on FDX platform
Latest News
- Europe’s Chip Industry: Perfect Storm or Perfect Timing?
- Skymizer and MiTAC Computing to Showcase a 2.8-Trillion-Parameter AI Model Running on a Single Air-Cooled Server at SC26
- Arteris Announces Financial Results for the Third Quarter and Estimated Fourth Quarter and Updated Full Year 2026 Guidance
- AccelerComm Partners With Tier-1 Mobile Network Operator to Pioneer AI-Controlled Energy Consumption in 5G Networks
- proteanTecs Appoints Head of Cadence Japan Toshifumi Kaneko to Advisory Board