Winbond Electronics Corporation and Qimonda AG Announce New Agreement for 65 nanometer Buried Wordline Technology Transfer
April 22, 2008—Winbond Electronics Corporation and Qimonda AG today announced a new agreement for 65nm Buried Wordline DRAM Technology Transfer. Winbond and Qimonda have remained successful partnership since collaboration. The agreement, referring to a new DRAM technology roadmap unveiled by Qimonda, will replace the existing contract of 58nm DRAM trench technology transfer between the two companies. The relevant terms and conditions of this new agreement, meanwhile, will be similar to the previous contract. The buried wordline DRAM technology will be performed in Winbond’s 300 mm wafer fab in the future.
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