Tundra Semiconductor Selects Synopsys as Its Primary EDA Partner
Synopsys' Differentiated Offering of Tools, IP and Services Cited as Key to Selection
MOUNTAIN VIEW, Calif. -- March 9, 2009 -- Synopsys, Inc. , a world leader in software and IP for semiconductor design and manufacturing, today announced that Tundra Semiconductor Corporation , a leader in System Interconnect, has selected Synopsys as its primary EDA partner. The agreement continues a multi-year collaboration that has resulted in the tapeout of multiple chips for leading communications, computing and storage companies. Synopsys has a strong track record helping Tundra control costs by delivering services, IP and tool integration in a customized flow that maximizes engineering productivity.
"During the past four years we have continued to build a successful relationship with Synopsys by partnering on the tapeout of several advanced process technology products," said Ed Vopni, vice president of Engineering and Operations at Tundra. "We chose Synopsys as our primary EDA partner because they are the best vendor to deliver the services, IP, tools and support we need to bring leading-edge PCIe and RapidIO chips to the market. Synopsys' solutions have allowed us to focus our engineering resources on delivering higher-value, differentiated products that solve our customers design needs."
With this latest agreement, Tundra has now chosen products and services across Synopsys' comprehensive portfolio, including Synopsys DesignWare® cores; Synopsys' Galaxy™ design platform featuring IC Compiler place-and-route technology, Design Compiler® synthesis, Galaxy Custom Designer™ mixed-signal implementation, PrimeTime® timing analysis, Star-RCXT™ parasitic extraction, Hercules™ physical verification, DFT MAX scan compression synthesis, and TetraMAX® automatic test pattern generation; and Synopsys' Discovery™ verification platform featuring the VCS®, HSPICE® and HSIM® simulators for analog and digital verification.
"In today's challenging business climate, companies are re-evaluating how chips and systems are developed," said Joachim Kunkel, vice president and general manager for Synopsys' Solutions Group. "As the cost of design rises, companies need to focus on developing core competencies and key partnerships to maximize engineering productivity. Synopsys looks forward to continuing to work closely with Tundra to drive process and cost efficiencies as Tundra introduces new technologies at lower geometries."
About Synopsys
Synopsys, Inc. is the world leader in electronic design automation (EDA), supplying the global electronics market with the software, intellectual property (IP) and services used in semiconductor design and manufacturing. Synopsys' comprehensive, integrated portfolio of implementation, verification, IP, manufacturing and field-programmable gate array (FPGA) solutions helps address the key challenges designers and manufacturers face today, such as power and yield management, software-to-silicon verification and time-to-results. These technology-leading solutions help give Synopsys customers a competitive edge in bringing the best products to market quickly while reducing costs and schedule risk. Synopsys is headquartered in Mountain View, California, and has more than 60 offices located throughout North America, Europe, Japan, Asia and India. Visit Synopsys online at http://www.synopsys.com/.
Related Semiconductor IP
- AXI5 to/from AXI4 Bridge
- AXI5-Stream to/from AXI4-Stream Bridges
- APB5 to APB4 bridge
- UALink PHY + Controller
- General Purpose Low-Dropout (LDO) - TSMC
Related News
- Tundra Semiconductor Leads RapidIO Market with Launch of First Commercially Available Products
- Tundra pays $10 million for IBM's PCI-X Bus Bridge product line
- Xilinx RapidIO Solution Successfully Interoperates With Freescale PowerQUICC III Processor & Tundra RapidIO Switch
- Gov'T of Canada Invests $7M In Tundra Semiconductor to Develop Next-Generation RapidIO Technology
Latest News
- CAST Expands Functional Safety IP Line with ASIL B Ready SENT/SAE J2716 Receiver Core
- SkyeChip Advances Custom Interface IP Engagement with Cerebras for Wafer-Scale AI Platforms
- SEALSQ and GlobalFoundries Partner to Accelerate Post-Quantum Cryptography and Quantum Computing Technologies
- Arteris Announces Collaboration with IC-Link by imec to Accelerate Next-Gen AI and HPC Silicon
- SambaNova Completes First Close of $1B Financing at $11B Valuation