TSMC in talks to build fab in Dresden
By David Manners, ElectronicsWeekly (December 23, 2022)
TSMC is talking to suppliers about the possibility of putting a fab in Dresden, reports the Nikkei.
The talks are said to be about whether the suppliers would make the investments to support the fab.
To read the full article, click here
Related Semiconductor IP
- 100G TCP/IP Hardware Stack
- UCIe IP Core
- GDDR6 Controller
- PCIe Gen 6 IP Core
- Protocol-Neutral Custom Fabric
Related News
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Bosch opens wafer fab of the future in Dresden
- Infineon plans €5bn 300mm fab in Dresden
- ESMC Breaks Ground on Dresden Fab
Latest News
- EnSilica to open Space and Communications Semiconductor Centre of Excellence in Milan
- Samsung Electronics and ASML expand strategic collaboration for next-generation semiconductor manufacturing
- SEMIFIVE Commences Mass Production of HyperAccel’s LLM AI Inference Accelerator ‘Bertha’ on Samsung 4nm, Spurring Growth Momentum
- Arm unveils Arm AI Portal to accelerate optimized AI apps across the Arm compute platform
- Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High NA EUV