Infineon plans €5bn 300mm fab in Dresden
By David Manners, Electronics Weekly (November 16, 2022)
Infineon is planning a €5 billion fab in Dresden if it can get government subsidies.
Building the fab is dependent on state support for the Dresden factory, said CEO Jochen Hanebeck (pictured), adding that he has received a political signal.
He has said he would like to have more capacity for products made on processes with geometries ranging fron 28nm to 12nm to reduce reliance on Taiwan foundries.
The German economy ministry says it will “quickly examine the funding possibilities for the project announced by Infineon in terms of state aid and subsidy law’.
To read the full article, click here
Related Semiconductor IP
- nQrux® Root of Trust IP
- AXI to UCIe Bridge IP
- UCIe 2.x Controller IP
- SWI3S (SoundWire I3S Interface) Peripheral Controller Core IP
- OpenTitan-based RISC-V Secure Element
Related News
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- 300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports
- 300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports
- Bosch opens wafer fab of the future in Dresden
Latest News
- JEDEC® Publishes First Industry-Wide Silicon Photonics Reliability Standard for AI, Datacenter and Telecom Infrastructure
- Orthogone Technologies Launches Ultra-Low-Latency FPGA IP Portfolio for Multi-Industry Deterministic Networking
- TIER IV joins Arm Total Design for Physical AI to accelerate ready-to-use Autoware solutions through Open AD Kit
- SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program
- ICTK to Acquire Network Security Firm withnetworks, Expanding from Security Chips into Global Enterprise Security Solutions