TSMC 2nm to start production in Q4 2025
By David Manners, ElectronicsWeekly (November 8, 2024)
TSMC will start producing 2nm GAA-based wafers in Q4 2025 at its Fab 20 in Hsinchu which has a capacity of 30k wpm and will be followed by the 30k wpm Fab 22 in Kaohsiung which is expected to start produxtion in Q1 2026.
Related Semiconductor IP
- Mesochronous Bridge for PCIe/CXL
- AI-native GPU
- OpenGMSL Verification IP
- OpenGMSL Leaf IP
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
Related News
- TSMC 2nm yields nearly ready for mass production
- AMD Announces Production Ramp of Next-Generation AMD EPYC Processor “Venice” on TSMC 2nm Process Technology
- M31 Technology: Strong Demand for 2nm IP Signals a Q4 Operational Recovery
- Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production
Latest News
- SignatureIP Unveils MesoLink, a Mesochronous Bridge for PCIe/CXL Validation
- ICTK Partners with Jiran Security to Drive Post-Quantum Cryptography (PQC) Migration
- S2C Named Andes Technology’s 2026 Partner of the Year
- BrainChip Launches AKD1500 PCIe Card For Edge AI Evaluation Everywhere
- TDK-Micronas adopts Aniah’s AI-powered OneCheck® platform to advance automotive semiconductor development