Trident Microsystems Licenses CEVA's DSP for Set-Top Box and DTV Product Lines
SAN JOSE, Calif., May 27, 2010 -- CEVA, Inc. [(Nasdaq: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Trident Microsystems has licensed CEVA's DSP technology for demodulation in set-top box and television systems product lines. Trident's recent acquisition of NXP Semiconductor's television systems and set-top box business lines has established the Company as a global leader in digital home entertainment and a top three player in both the television and set-top box market segments.
"We are pleased to partner with Trident as they expand their digital home entertainment portfolio with a range of new and innovative products," said Gideon Wertheizer, CEO of CEVA. "Our best-of-breed DSP cores continue to gain traction in the digital home entertainment arena and Trident, as a top three semiconductor supplier for DTV and set-top boxes, further strengthens our position in this lucrative market."
About CEVA, Inc.
CEVA is the leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, including handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every four handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- Ceva Wins Landmark AI Licensing Deal with Major U.S. Software and AI Platform Company
- Trident, Via agree to end legal suits
- MIPS Technologies Files Lawsuit Against Trident Microsystems
- MIPS Technologies and Trident Microsystems Complete Licensing Agreement for MIPS32 24KEc Pro Core
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers