TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
April 29, 2026 -- TES Electronic Solutions GmbH expands its Power Management Unit IP portfolio by offering new bias current source and bandgap circuit IPs implemented in X-FAB XT018 - 0.18µm BCD-on-SOI technology. The bias circuits can supply a variety of currents in complex System-on-Chip (SoC) designs, particularly in automotive, industrial automation, and Internet of Things (IoT) applications. The following IPs are now available:
Precision Bandgap Reference with Dual Current Sources: TS_BG_02uA_X8- Octuple Bias Current Source: TS_CS_20uA_X8
- 250nA-88μA Current Reference: TS_IREF_88uA_X8
TES will make supporting your design effort a priority – whether it is integrating this IP into your design or implementing a complete ASIC.
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related News
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- TES offers a High-Frequency Synthesizer and Clock Generator IP for X-FAB XT018 - 0.18µm BCD-on-SOI technology
- TES offers a new LED Driver IP in X-FAB XT018-0.18µm BCD-on-SOI CMOS
- TES offers new High-Speed Comparator IPs for X-FAB XT018 - 0.18µm BCD-on-SOI technology.
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA