ST decides to import CMOS, change Crolles function
Peter Clarke, EE Times
(01/25/2007 9:15 AM EST)
LONDON — Carlo Bozotti, chief executive officer of STMicroelectronics NV, told analysts Wednesday (Jan. 24) that ST would align with "industry leaders" to obtain a 32-nm CMOS process for use in its wafer fabs and as a platform for specialized extensions.
Bozotti did not say who would provide ST with its 32-nm CMOS platform but said: "It is obvious we have alternatives."
At present ST is aligned with leading foundry, Taiwan Semiconductor Manufacturing Co. Ltd. which is an associate partner to ST, Freescale Semiconductor Inc. and NXP BV in the Crolles2 R&D alliance.
Speaking during a conference call for analysts Bozotti said that the Crolles2 Alliance would complete the development of 45-nm CMOS process technology during 2007 but there would then be a "discontinuation" in the role of the Crolles development center and pilot fab.
(01/25/2007 9:15 AM EST)
LONDON — Carlo Bozotti, chief executive officer of STMicroelectronics NV, told analysts Wednesday (Jan. 24) that ST would align with "industry leaders" to obtain a 32-nm CMOS process for use in its wafer fabs and as a platform for specialized extensions.
Bozotti did not say who would provide ST with its 32-nm CMOS platform but said: "It is obvious we have alternatives."
At present ST is aligned with leading foundry, Taiwan Semiconductor Manufacturing Co. Ltd. which is an associate partner to ST, Freescale Semiconductor Inc. and NXP BV in the Crolles2 R&D alliance.
Speaking during a conference call for analysts Bozotti said that the Crolles2 Alliance would complete the development of 45-nm CMOS process technology during 2007 but there would then be a "discontinuation" in the role of the Crolles development center and pilot fab.
To read the full article, click here
Related Semiconductor IP
- Verification IP for C-PHY
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
Related News
- Rambus plans U.S. suit against Hyundai, asks for change of venue
- Aldec Provides Xilinx® Foundation Series[tm] Users a Seamless Schematic Import and Design Reuse Option
- Design reuse requires culture change, IP developers say
- ST takes stake in 8x8 in exchange for VoIP, DSP core license
Latest News
- JEDEC Advances DDR5 MRDIMM Ecosystem with New Memory Interface Logic and Expanded MRDIMM Roadmap
- Altera Brings Determinism to Physical AI Systems with Latest Release of FPGA AI Suite
- Mosaic SoC raises $3.8M to bring real-time spatial intelligence to every consumer device
- UMC Reports First Quarter 2026 Results
- Rambus Appoints Sumeet Gagneja as Chief Financial Officer