Sonics SMART Interconnect Intellectual Property for Advanced Sytem on Chip Designs Optimized for Texas Instruments Wireless Platform

Mountain View, California - 2002/10/21 - Sonics, Inc. today announced it will provide Texas Instruments (TI) with early access to a new generation of Sonics SMART interconnect intellectual property products for the implementation of system on chip (SOC) designs. Details of the new architecture, code-named "Tiger Shark," which has been optimized for the application demands of TI’s wireless platform product families, will be revealed late this year when the first product starts shipping to advance licensees.

“The combination of TI’s market leadership and expertise in developing high performance, low power wireless solutions and Sonics’ new architecture will benefit even the most power-sensitive applications,” said Grant Pierce, president and CEO of Sonics, Inc. “This is the first of several cooperative development programs to ensure Sonics products evolve with the cooperation and perspective of the SOC industry’s leaders.”

“TI is working closely with Sonics to develop a product that enables TI to rapidly deliver SOCs for different market segments, such as wireless terminals and PDAs, while ensuring low power and high performance for its customers,” said Yves Masse, chief OMAP architect and TI Fellow. “TI’s wireless expertise coupled with the unique functionality and flexibility of Sonics’ SMART interconnect products will enable us to create families of application-specific SOC designs for leading manufacturers.”

Both Sonics and TI are board members in the Open Core Protocol International Partnership (OCP-IPTM) that promotes a complete socket standard to ensure rapid creation and integration of interoperable intellectual property cores. Sonics has committed that products based on its new architecture will be fully OCP-compliant.

About Sonics, Inc.
Sonics, Inc. is a premier developer of intelligent semiconductor intellectual property (IP) solutions that dramatically accelerate complex system-on-chip (SOC) designs while minimizing risk. The Sonics Methodology and Architecture for Rapid Time-to market (SMART ) initiative is a comprehensive collection of products, services and partnerships to ensure customer success when utilizing Sonics’ SMART interconnect IP. SMART users can develop devices with higher functionality, lower power consumption and lower cost while achieving greater SOC complexity faster. Major semiconductor and systems companies have embraced Sonics SMART products for SOC applications in the communications, networking and multimedia markets, often reporting better than six-month design time savings with reduced design and manufacturing risks. For more information, see www.sonicsinc.com.