SMIC Well on Its Way to 5-nm Breakthrough, Observers Say
By Alan Patterson, EETimes (September 20, 2023)
Semiconductor Manufacturing International Corp. (SMIC) is likely to, in the next few years, again defy the U.S. government by manufacturing chips with feature sizes as small as 5 nm, industry insiders told EE Times.
The production of 7-nm silicon by China’s largest chipmaker just days ago has crossed a red line set by the U.S. government to keep its rival nation stalled at the 14-nm node. SMIC’s widely reported breakthrough erodes the U.S. strategy to use export controls and blacklists to halt China’s technological progress, according to Dick Thurston, former chief legal counsel for Taiwan Semiconductor Manufacturing Co. (TSMC).
“I never had any doubt that they would be doing 7 [nm], and I still don’t have any doubt that they’ll do 5 nm without the EUV tools,” he told EE Times.
To read the full article, click here
Related Semiconductor IP
- SMIC 130nm EEPROM Compact digital IO for smart card or bank card application
- SMIC 65nm LL(HVt) ECO cells compatible with VHS standard cell library.
- SMIC 65nm LL DDR3/DDR2/LPDDR2 COMBO interface for DRAM application
- SMIC 65nm LL Standard digital and oscillator IO
- SMIC 65nm LL Standard analog IO
Related News
- Imec and Cadence Complete Tapeout of First 5nm Test Chip
- Innosilicon Receives "Best Partner of the Year 2015" Award from SMIC
- SMIC Reports 2015 Third Quarter Results
- Sidense Qualifies 1T-OTP Memory IP at SMIC 130nm and 110nm Processes
Latest News
- SEMIFIVE Accelerates Growth with 97% YoY Revenue Surge in H1 2026, Powered by ASIC Turnkey, Mass Production, and IP
- Andes Technology has shut down Condor Computing
- TIER IV joins JST’s Next-Generation Edge AI Semiconductor R&D Program to open-source AI chip designs for autonomous driving
- BrainChip Partners With Orama.AOI For AI-Fueled Defect Detection
- PUFsecurity, subsidiary of eMemory, Advances Hardware-anchored Trust for AI Infrastructure at OCP APAC 2026