SMIC Well on Its Way to 5-nm Breakthrough, Observers Say
By Alan Patterson, EETimes (September 20, 2023)
Semiconductor Manufacturing International Corp. (SMIC) is likely to, in the next few years, again defy the U.S. government by manufacturing chips with feature sizes as small as 5 nm, industry insiders told EE Times.
The production of 7-nm silicon by China’s largest chipmaker just days ago has crossed a red line set by the U.S. government to keep its rival nation stalled at the 14-nm node. SMIC’s widely reported breakthrough erodes the U.S. strategy to use export controls and blacklists to halt China’s technological progress, according to Dick Thurston, former chief legal counsel for Taiwan Semiconductor Manufacturing Co. (TSMC).
“I never had any doubt that they would be doing 7 [nm], and I still don’t have any doubt that they’ll do 5 nm without the EUV tools,” he told EE Times.
To read the full article, click here
Related Semiconductor IP
- SMIC 130nm EEPROM Compact digital IO for smart card or bank card application
- SMIC 65nm LL(HVt) ECO cells compatible with VHS standard cell library.
- SMIC 65nm LL DDR3/DDR2/LPDDR2 COMBO interface for DRAM application
- SMIC 65nm LL Standard digital and oscillator IO
- SMIC 65nm LL Standard analog IO
Related News
- Imec and Cadence Complete Tapeout of First 5nm Test Chip
- SMIC Reports 2015 Third Quarter Results
- Sidense Qualifies 1T-OTP Memory IP at SMIC 130nm and 110nm Processes
- SMIC and M31 Introduce Differentiated IP Solutions for Various Storage Controller Applications
Latest News
- Sofics Extends Interface Voltage Options in TSMC FinFET and Nanosheet Technologies
- aiMotive and Cadence Demonstrate Layer-by-Layer Workload Placement Across Independent AI Engines
- Alchip collaborates with Synopsys to Address Scale Up and Out Bandwidth Constraints
- M31 and Ambiq Collaborate on TSMC N12e® Foundation IP to Address Demanding SoC Power and Area Targets
- Siemens and TSMC advance AI-powered semiconductor design automation