Vendor: SMIC Category: EEPROM

SMIC 130nm EEPROM Compact digital IO for smart card or bank card application

SMIC 130nm G Silicon Proven View all specifications

Key features

Compact digital IO for smart card or bank card application;
Cell Size (Width * height) 172um*230um with DUP inline bonding pads;
Work voltage:1.8V/3V/5V power;
SMIC 0.13um e-EEPROM (AEE2) Salicide 1.5V LL/5V/15.5V Process;
Suitable for 4,5 and 6 layers application ;

Silicon Options

Foundry	Node	Process	Maturity
SMIC	130nm	G	Silicon Proven

Specifications

Identity

Part Number

SPC013LLEED5P_PG_CARD

Vendor

SMIC

Type

Silicon IP

Provider

SMIC

HQ: China

Frequently asked questions about EEPROM IP cores

What is SMIC 130nm EEPROM Compact digital IO for smart card or bank card application?

SMIC 130nm EEPROM Compact digital IO for smart card or bank card application is a EEPROM IP core from SMIC listed on Semi IP Hub. It is listed with support for smic Silicon Proven.

How should engineers evaluate this EEPROM?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this EEPROM IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.