RISC-V Pivots from Academia to Industrial Heavyweight
By Pablo Valerio, EE Times | February 11, 2026

The RISC-V architecture is rapidly expanding globally. China leads with 50% of shipments and heavy investment, while Europe seeks technological sovereignty through sustainable, low-power designs.
Once regarded as an academic curiosity born in 2010 at the University of California, Berkeley, the open-standard instruction set architecture (ISA) is now aggressively targeting high-performance computing (HPC), AI, and automotive sectors.
In a recent interview with EE Times, Andrea Gallo, CEO of RISC-V International, explained that RISC-V’s strategy now focuses on specialization and modularity instead of trying to be everywhere. This shows the architecture has moved past its experimental stage and is now being widely adopted in industry.
According to the organization’s 2025 Annual Report, RISC-V’s market share is expected to grow from 2.5% in 2021 to 33.7% by 2031. This rapid growth is driven by countries like China and India using the open standard to gain more control over their technology.
To read the full article, click here
Related Semiconductor IP
- RISC-V IOPMP IP
- RISC-V Debug & Trace IP
- Gen#2 of 64-bit RISC-V core with out-of-order pipeline based complex
- 64-bit RISC-V core with in-order single issue pipeline. Tiny Linux-capable processor for IoT applications.
- Tiny, Ultra-Low-Power Embedded RISC-V Processor
Related News
- A 10-cent RISC-V microcontroller from China? Why not?
- Semidynamics: From RISC-V with AI to AI with RISC-V
- SEALSQ Receives Final Approval from the French Ministry of the Economy, Finance and Industrial and Digital Sovereignty and Completes Acquisition of IC’ALPS
- SiFive’s New RISC-V IP Combines Scalar, Vector and Matrix Compute to Accelerate AI from the Far Edge IoT to the Data Center
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release