Rambus Appoints Luc Seraphin as President and Chief Executive Officer
SUNNYVALE, Calif. – Oct. 29 2018 – Rambus Inc. (NASDAQ: RMBS), today announced that its Board of Directors has appointed Luc Seraphin as president and chief executive officer, effective immediately.
Eric Stang, Chairman of the Rambus Board of Directors, said, “We are very pleased to have Luc as CEO. Our search process was exhaustive, and Luc’s strategic vision, leadership, and focus on execution made him the obvious choice to lead Rambus to its next phase of success. His deep familiarity with Rambus and demonstrated leadership in developing our go forward execution-oriented strategy over the past few months allows the company to move forward quickly.”
“Rambus has long been seen as a forward-thinking company continually on the leading edge of technology and is well positioned to deliver on the promise of data, faster and safer. There are tremendous opportunities ahead for our product and IP businesses and I look forward to continuing my leadership with a focus on shareholder value,” said Luc Seraphin, president and CEO of Rambus.
Mr. Seraphin has been performing as interim CEO since June 2018. With over 20 years of experience managing global businesses, Luc brings the overall vision and leadership necessary to drive future growth for the company. Prior to this role, Luc served at Rambus as Senior Vice President & General Manager of the Memory and Interfaces Division, Rambus’ largest business unit. During his time at the Company, Mr. Seraphin has overseen sales, customer support and engineering operations, increasing Rambus’ market footprint for its high-speed IP cores and DDR4 memory buffer chipset and positioning the Company as a leader in next-generation DDR5 memory buffer chips.
Audio Conference Call
Rambus will discuss this announcement as part of the conference call on October 29, 2018 at 2:00 p.m. Pacific Time to discuss its third quarter 2018 results. This call will be webcast and can be accessed via Rambus’ website at investor.rambus.com. A replay will be available following the call on the Rambus Investor Relations website or for one week at the following numbers: (855) 859-2056 (domestic) or (404) 537-3406 (international) with ID# 4888626.
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- Rambus Announces Departure of Ron Black as Chief Executive Officer; Luc Seraphin Appointed Interim CEO
- Dr. Walden Rhines Joins Cornami as President and CEO
- Composable Data Center Innovator, IntelliProp Names Tech Veteran John Spiers as CEO and President
- Simon Davidmann President & CEO of Imperas Software elected as Chair of the OpenHW Verification Task Group
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers