Nokia set to pay Qualcomm $2.3bn in patent deal
John Walko, EE Times
(10/16/2008 10:19 AM EDT)
LONDON — Hidden away in Nokia's third quarter results was confirmation that the Finnish handset maker will pay Qualcomm Inc. Euros 1.7 billion ($2.3 billion) as part of the patent agreement between the companies.
Until now, the exact size of the payment has not been revealed.
The agreement reached in July ended a long-running dispute between the companies, granted Nokia a licence under all Qualcomm's patents for use in Nokia's mobile devices and Nokia Siemens Networks infrastructure equipment.
(10/16/2008 10:19 AM EDT)
LONDON — Hidden away in Nokia's third quarter results was confirmation that the Finnish handset maker will pay Qualcomm Inc. Euros 1.7 billion ($2.3 billion) as part of the patent agreement between the companies.
Until now, the exact size of the payment has not been revealed.
The agreement reached in July ended a long-running dispute between the companies, granted Nokia a licence under all Qualcomm's patents for use in Nokia's mobile devices and Nokia Siemens Networks infrastructure equipment.
To read the full article, click here
Related Semiconductor IP
- 100-10Gbps Ethernet MAC Controller
- SD Card Controller
- AXI4 Memory Controller IP Core
- AXI-Lite I2C Controller Core
- LVDS Transceiver IP core
Related News
- Qualcomm Signs 3G/4G China Patent License Agreement with vivo
- Nokia expands patent litigation against Apple in Asia, Europe and the US
- Qualcomm Booking $4.5B in Apple Deal
- Qualcomm And LGE Enter Into a New Global Patent License Agreement
Latest News
- BrainChip Launches AKD1500 Raspberry Pi 5 Kit: Giving Developers a Direct Path from Prototype to Production
- Cadence Joins the Genesis Mission Consortium to Advance AI-Driven Scientific Discovery and Microelectronics Innovation
- Onsemi picks up Codasip’s low-end RISC-V business for $14.5 million
- Semidynamics and Nokia Explore Collaboration to Strengthen Europe’s Sovereign AI Capabilities
- VeriSilicon Introduces GLTiny™ 3D GPU Programming Model for Ultra-Low-Power, Memory-Efficient Wearable Devices