Lenovo to design own chips
Junko Yoshida, EETimes
3/29/2013 1:20 PM EDT
BEIJING, China– Lenovo, the second largest smartphone supplier in China, will get into the chip design business with a special focus on smartphones and tablets, EE Times has learned.
The company, which has maintained a small IC design team consisting of about 10 people over the last decade, is now committed to expanding this team to about 100 engineers by the middle of this year, according to a China-based industry source with direct knowledge of Lenovo’s recruitment of chip designers.
To read the full article, click here
Related Semiconductor IP
- Dual Channel 8b D/A Converter - TSMC T40ULP
- Dual Channel 12b D/A Converter - TSMC T40ULP+ESF3
- 8bit D/A Converter - TSMC 22nm ULP
- 12bit 2MSps A/D Converter - TSMC T22ULP
- TSMC 2nm 1V2 GPIO
Related News
- Quadric, Inference Engine for On-Device AI Chips, Raises $30M Series C as Design Wins Accelerate Across Edge
- Safe and Secure Technologies, the new BSC and UPC spin-off that will design chips for critical sectors where “failure is not an option”
- Siemens unveils AI-powered library characterization to accelerate semiconductor design
- Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder