Kilopass' CEO Charlie Cheng to Keynote Chinese American Semiconductor Professional Association
Will Offer Memory Technologies Forecast for 2020, Highlight Broader Market Survey and Roadmap
SAN JOSE, CALIF. –– August 14, 2015 –– (reminder October 22)
WHO: Charlie Cheng, Chief Executive Officer of Kilopass Technology, Inc., the leading provider of semiconductor embedded non-volatile memory (eNVM) intellectual property (IP)
WHAT: Will be a keynote speaker at the Chinese American Semiconductor Professional Association (CASPA) Conference and Dinner Banquet themed, “Pioneering Technologies –– Year 2020 In the Making.” His keynote talk is titled, “Boundless Memory Technologies for 2020, Broader Market Survey & Roadmap.” “Pioneering Technologies –– Year 2020 In the Making.”
WHEN: Saturday, Oct. 24, from 2:15 p.m. until 2:50 p.m.
WHERE: Santa Clara Convention Center, Santa Clara, Calif.
Kilopass, based in San Jose, Calif., is the leading provider of antifuse eNVM IP. Its features include ultra-low power and high performance, fast access speed, megabits of capacity, more than 10 years of data retention and flexible programming options.
For information about Kilopass, visit: www.kilopass.com
About Kilopass
Kilopass Technology, Inc., is the leader in embedded non-volatile memory (NVM) intellectual property (IP). Its patented technologies of one-time programmable (OTP) NVM solutions have boundless capacity to scale to advanced CMOS process geometries. They are portable to every major foundry and integrated device manufacturer (IDM), and meet market demands for increased integration, higher densities, lower cost, low-power management, better reliability and improved security. Trusted by today's best-known brands, Kilopass' technology has been integrated by more than 170 customers, with 10-billion units shipped in over 400 industrial, automotive, consumer electronics, mobile, analog and mixed-signal, and internet of things (IoT) chip designs. For more information, visit www.kilopass.com or email info@kilopass.com
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- FSA Announces New Alliance with the Chinese American Semiconductor Professional Association (CASPA)
- Qualitas Semiconductor Signs PCIe Gen 4.0 PHY IP License Agreement with Leading Chinese Fabless Customer
- GlobalFoundries Files Patent Infringement Lawsuits Against Tower Semiconductor to Protect High-Performance American Chip Innovation
- Denali Software Joins RapidIO Trade Association
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers