Setting the record straight on the Intel-TSMC 3-D 'race'
Dylan McGrath, EETimes
7/11/2011 1:29 AM EDT
What's not to love about a story that pits semiconductor process technology leaders Intel Corp. and Taiwan Semiconductor Manufacturing Co. (TSMC) against one another in a race to achieve some high-level technical goal?
Last week, a report by the Taiwan External Trade Development Council (TAITRA), a nonprofit organization promoting trade with Taiwanese firms, did just that, issuing a report that tantalizingly suggested that TSMC might beat Intel to the punch in bringing "three-dimensional chips" to market. EE Times and other news organizations quickly seized on the report and published stories based on it.
The problem, as many EE Times readers promptly pointed out, is that the report was deeply flawed and based upon a false equivalency.
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- Vulcan ASIC Ltd. rekindles Java core race with Moon IP
- Chartered battles to stay in foundry race
- Actel FPGAs Accelerate Development of Multiple-Application Race Car Engine Control Units
- STMicroelectronics Wins the Race to Deliver First 65-nm CMOS Design Platform
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools