Intel brings 3nm production to Europe in 2025
By Nick Flaherty, eeNews Europe | March 28, 2025
Intel 3 is the company’s second EUV lithography node with an 18% performance-per-watt improvement over Intel 4. The process is offered to foundry customers and was in high-volume manufacturing in Oregon during 2024, with high-volume manufacturing shifted to Leixlip in Ireland for 2025, it said in its annual report. This is the first confirmation of 3nm production after ramping up the first generation EUV process.
The Xeon 6 Scalable server processor offerings are built on this technology.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- Intel 16 3.3V Open-Drain IO With 5V Failsafe and 5V Tolerant
- Intel 18A 1.2V/1.5V GPIO Library Fail-Safe
- Intel 18A 1.2V/1.5V GPIO Library
- Intel 16 1.8V GPIO Library
Related News
- Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings
- Intel Retreat Shifts Europe Semiconductor Reality
- InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem
- The 2025 deals reshaping the semiconductor industry
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release