Intel brings 3nm production to Europe in 2025
By Nick Flaherty, eeNews Europe | March 28, 2025
Intel 3 is the company’s second EUV lithography node with an 18% performance-per-watt improvement over Intel 4. The process is offered to foundry customers and was in high-volume manufacturing in Oregon during 2024, with high-volume manufacturing shifted to Leixlip in Ireland for 2025, it said in its annual report. This is the first confirmation of 3nm production after ramping up the first generation EUV process.
The Xeon 6 Scalable server processor offerings are built on this technology.
To read the full article, click here
Related Semiconductor IP
- Sleep Management Subsystem
- Die-to-Die, AIB 2.0 PHY Ported to Intel 16, North/South (vertical) poly orientation
- Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N7 X24
- Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N5 X24, North/South (vertical) poly orientation
- Die-to-Die, High Bandwidth Interconnect PHY in TSMC (N7, N5)
Related News
- Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings
- Intel Retreat Shifts Europe Semiconductor Reality
- InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem
- The 2025 deals reshaping the semiconductor industry
Latest News
- Arteris Deployed by Speedata for Data Center Compute
- Siemens to acquire Defacto Technologies to complement its EDA portfolio with automated SoC design creation
- Mach42 Completes £7M Funding Round, Led by IP Group With Investment From BGF and Foresight Group
- ELECTRA IC Unveils Comprehensive IP Core Suite for Next-Generation Post-Quantum Cryptography
- CAST Enhances Serial Memory Controller IP with Encryption, Low-Power, and ASIL-Ready Options