Report: Infineon talks to Intel over sale of wireless unit
Peter Clarke, EETimes
(05/17/2010 9:24 AM EDT)
Infineon's wireless unit has achieved success supplying 3G communications chips to Apple for the iPhone and iPad and also supplies mobile phone companies including Nokia and Samsung.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- Altera and BigCat Wireless Partner to Accelerate Deployment of Altera’s Open Radio Unit Reference Designs in Wireless Communications Infrastructure
- Intel ASIC unit to focus on comms chips and is building a network of third-party intellectual-property suppliers to support the effort
- Philips Semi, Cadence's Tality unit team up in Bluetooth solutions
- LSI Logic Licenses Synthesizable ARM926EJ-S Core With a Memory Management Unit and Java Support
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers