Report: Infineon talks to Intel over sale of wireless unit
Peter Clarke, EETimes
(05/17/2010 9:24 AM EDT)
Infineon's wireless unit has achieved success supplying 3G communications chips to Apple for the iPhone and iPad and also supplies mobile phone companies including Nokia and Samsung.
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- Altera and BigCat Wireless Partner to Accelerate Deployment of Altera’s Open Radio Unit Reference Designs in Wireless Communications Infrastructure
- Intel ASIC unit to focus on comms chips and is building a network of third-party intellectual-property suppliers to support the effort
- Philips Semi, Cadence's Tality unit team up in Bluetooth solutions
- LSI Logic Licenses Synthesizable ARM926EJ-S Core With a Memory Management Unit and Java Support
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools