Inapac gains funding, tips IP roadmap
Mark LaPedus, EE Times
(05/03/2006 9:46 PM EDT)
SAN JOSE, Calif. — Seeking to bring its intellectual-property (IP) chip business to the next level, Inapac Technology Inc. has outlined its product roadmap, obtained a new round of funding and named a new sales executive.
Inapac, a system-in-package (SiP) memory integrator, has secured $14 million in a fourth round of financing. This latest round was led by Third Point Ventures and included support from previous investors, according to the company, based here.
The IP chip company also announced that Karen Lamar has joined the management team as vice president of sales. Lamar was previously vice president of worldwide sales and marketing at Monolithic Systems Technology Inc. (Mosys).
(05/03/2006 9:46 PM EDT)
SAN JOSE, Calif. — Seeking to bring its intellectual-property (IP) chip business to the next level, Inapac Technology Inc. has outlined its product roadmap, obtained a new round of funding and named a new sales executive.
Inapac, a system-in-package (SiP) memory integrator, has secured $14 million in a fourth round of financing. This latest round was led by Third Point Ventures and included support from previous investors, according to the company, based here.
The IP chip company also announced that Karen Lamar has joined the management team as vice president of sales. Lamar was previously vice president of worldwide sales and marketing at Monolithic Systems Technology Inc. (Mosys).
To read the full article, click here
Related Semiconductor IP
- Ultra-low jitter, low-power ring-oscillator-based PLL-3GHz-4GHz
- Image Warping IP
- Image Warping IP
- ML-KEM-X Post-Quantum Cryptography Core
- AXI5 to/from AXI4 Bridge
Related News
- UMC tips roadmap, questions 450-mm
- ARM tips 'gods and giants' roadmap
- ARM gains access to picoTurbo's RISC customers in suit settlement
- Tality tips 802.11 MAC
Latest News
- INCIRT Announces Availability of Its PLL Series in the GlobalFoundries (GF) GlobalSolutions™ Ecosystem
- Imec and Diraq demonstrate first coherent operation of eight silicon MOS spin qubits fabricated in a 300mm CMOS-compatible foundry process
- RISC-V Is Inevitable, State of the Union Keynote Argues
- Intel Invests €5 Billion to Expand Manufacturing in Europe
- SEALSQ and Quobly sign $5 Million commercial agreement to integrate post-quantum security into next-generation silicon quantum computing platforms