Tokyo Electron Device Announces New Imaging Application Evaluation Platform Equipped With Spartan-3 Generation FPGA
Significantly reduce development period of image interface and image processing algorithm
Santa Clara, CA. -- May 13, 2008 -- Tokyo Electron Device Limited (TED) has today announced the inrevium “TB-3S-1400AN-IMG/TB-3S-3400DSP-IMG”, an imaging application evaluation platform equipped with Xilinx Spartan-3 AN/A-DSP FPGA.
“In recent years, imaging applications have penetrated every market ranging from broadcasting, industrial and medical devices to surveillance devices, automobiles, and consumer audio-visual devices, and imaging interface development as well as image processing algorithm development in accordance with each application are accelerated. “ said Toshiaki Sunagawa, president and representative director of TED. “At the development side, faster development turnaround in response to shorter product lifecycles is demanded and at the same time, issues concerning manufacturing costs and maintenance have been pointed out, such as the requirement of a dedicated image processing PC for graphic user interfaces (GUI) such as touch panels in embedded devices.”
The inrevium TB-3S-1400AN-IMG/TB-3S-3400DSP-IMG supports the development of FPGA design in any kind of products that require image processing. Furthermore, TED also provides turnkey solutions cooperatively with IP partners and a wide variety of optional boards, in addition to the evaluation board.
IPs such as H.264 Encoder, Face Recognizer, Video Stabilizer, Dynamic Range Correction/Noise Reduction and GUI development environments for embedded devices are available. Various optional boards for a wide range of target applications including DVI, USB, CameraLink, and Analog video interfaces are also available. These enable to reduce a risk associated with the development efforts that use the latest FPGA and realize efficient functional evaluation of target applications, and enabling time-to-market.
- TB-3S-1400AN-IMG/TB-3S-3400DSP-IMG main features:
- FPGA: Xilinx XC3S1400AN/XC3SD3400A-4FGG676C
- 32M x 16bit (512Mbits) DDR2 SDRAM x4
- 8M x 8bit (64Mbits) Flash memory
- 10/100/1000 BASE Ethernet Ports x2
- Connector for touch panels, VGA output
- Expansion ports for optional board x2
- Reference design of DDR2 SDRAM frame buffer design (Verilog HDL) and graphic controller (VHDL)
TED will demonstrate various image processing applications on this board at “Embedded System Expo (ESEC)”, May 14-16 in Booth # East 38-16 of the Tokyo Big Sight, Tokyo, Japan.
Pricing and Availability
The inrevium TB-3S-1400AN-IMG/TB-3S-3400DSP-IMG is available now, with a price at US$1,440 and US$1,980. For more information, please visit http://www.inrevium.jp/eng/x-fpga-board/toraag.html
About Tokyo Electron Device Limited
Tokyo Electron Device is an affiliate of Tokyo Electron Limited, one of the world’s leading semiconductor manufacturing equipment suppliers. TED has sold its technology as a specialized electronics trading company inside Japan about 40 years, and now the company is applying its knowledge, technology and service capability to establish its inrevium product line in the global industrial market. For more information on inrevium products, visit the website at http://www.inrevium.jp/eng/
Related Semiconductor IP
- nQrux® Root of Trust IP
- AXI to UCIe Bridge IP
- UCIe 2.x Controller IP
- SWI3S (SoundWire I3S Interface) Peripheral Controller Core IP
- OpenTitan-based RISC-V Secure Element
Related News
- CEVA Announces New Application Developer Kit for CEVA-MM3000 Imaging & Vision Platforms
- VyperCore launches VyperLab, an evaluation platform to showcase its innovative compute accelerator technology
- Comcores Launches OmniGate: A Versatile and Compact Hardware Evaluation Platform for TSN Ethernet End Stations, Switches, and Gateways
- Omnitrx introduces Omni500 Ethernet Evaluation Platform, Built on Comcores Expertise
Latest News
- JEDEC® Publishes First Industry-Wide Silicon Photonics Reliability Standard for AI, Datacenter and Telecom Infrastructure
- Orthogone Technologies Launches Ultra-Low-Latency FPGA IP Portfolio for Multi-Industry Deterministic Networking
- TIER IV joins Arm Total Design for Physical AI to accelerate ready-to-use Autoware solutions through Open AD Kit
- SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program
- ICTK to Acquire Network Security Firm withnetworks, Expanding from Security Chips into Global Enterprise Security Solutions