Huawei, Qualcomm, Samsung Reveal Integrated 5G Chips
By Nitin Dahad, EETimes
September 6, 2019
Berlin, Germany — Mobile processors with integrated 5G modems are the flavor of the week, as Europe’s equivalent of CES kicked off in Berlin with launches from Huawei, Samsung and Qualcomm.
With big fanfare, Huawei launched what it claims is the world’s first flagship 5G system on chip (SoC), the Kirin 990 5G, a 10.3 billion transistor chip manufactured in a TSMC 7nm+ EUV process and supporting both non-standalone (NSA) and standalone (SA) radio architectures simultaneously. The chip will be a key feature of the Huawei Mate 30 phone launching in a couple of weeks.
To read the full article, click here
Related Semiconductor IP
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
- nQrux® Root of Trust IP
- AXI to UCIe Bridge IP
Related News
- SK hynix's memory chips next in Huawei's 5G phone saga
- SMIC, Huawei, imec, and Qualcomm in Joint Investment on SMIC's New Research and Development Company
- EdgeQ Adds Former Qualcomm CEO Paul Jacobs & CTO Matt Grob as Advisors to Disrupt the Current Closed RAN Ecosystem with RISC-V based Highly Programmable 5G and AI Platform
- GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products
Latest News
- Vayavya Labs and Tenstorrent Partner to Accelerate RISC-V Hardware and Software Development Through Virtual Platform Modeling
- RaiderChip’s Edge NPU reaches more than 50 Generative AI Models with the addition of Qwen3.8-27B
- Aion Silicon Named Design Solution Associate in New Rapidus CORE Ecosystem for 2nm Semiconductors
- Arteris Wins Funding to Expand Hardware Design Supply Chain Security Assurance for the Trusted and Assured Microelectronics Program
- UMC Reports Sales for September 2026