Huawei, Qualcomm, Samsung Reveal Integrated 5G Chips
By Nitin Dahad, EETimes
September 6, 2019
Berlin, Germany — Mobile processors with integrated 5G modems are the flavor of the week, as Europe’s equivalent of CES kicked off in Berlin with launches from Huawei, Samsung and Qualcomm.
With big fanfare, Huawei launched what it claims is the world’s first flagship 5G system on chip (SoC), the Kirin 990 5G, a 10.3 billion transistor chip manufactured in a TSMC 7nm+ EUV process and supporting both non-standalone (NSA) and standalone (SA) radio architectures simultaneously. The chip will be a key feature of the Huawei Mate 30 phone launching in a couple of weeks.
To read the full article, click here
Related Semiconductor IP
- Verification IP for C-PHY
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
Related News
- SK hynix's memory chips next in Huawei's 5G phone saga
- SMIC, Huawei, imec, and Qualcomm in Joint Investment on SMIC's New Research and Development Company
- EdgeQ Adds Former Qualcomm CEO Paul Jacobs & CTO Matt Grob as Advisors to Disrupt the Current Closed RAN Ecosystem with RISC-V based Highly Programmable 5G and AI Platform
- GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products
Latest News
- Tord Larsson-Steen appointed new CEO of Shortlink
- GUC Collaborate with Wiwynn to Advance Silicon-to-System Infrastructure for Next-Generation Hyperscale AI
- Two Weebit Nano product customers tape-out; one already demonstrating a functional prototype
- JEDEC Advances DDR5 MRDIMM Ecosystem with New Memory Interface Logic and Expanded MRDIMM Roadmap
- Altera Brings Determinism to Physical AI Systems with Latest Release of FPGA AI Suite