Flexible fab could slash chip shortage
By Nick Flaherty, eeNews Europe (July 09, 2021)
Richard Price, CTO at PragmatIC, talks to Nick Flaherty about a flexible fab approach that can slash the time taken to design and make a chip.
Silicon isn’t everything, says Richard Price at PragmatIC, a startup in Cambridge, UK specialising in flexible plastic chip technology.
A recent finalist in the technology awards for the Royal Academy of Engineering, the company has developed a chip-making process it calls FlexLogIC that has a dramatically shorter design and production time, especially for chips on older process technologies. This can fundamentally change the way chips are designed, especially for low cost sensors in the Internet of Things (IoT) says Price.
“There is an intersection in the low end complexity and IoT and RFID where there isn’t a great deal of value in the conventional semiconductor production on older lines,” he said.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related News
- Report: TSMC's 3nm Fab Could Cost $20 Billion
- Global 200mm Fab Capacity on Pace to Record Growth to Meet Surging Demand and Address Chip Shortage, SEMI Reports
- TSMC could partner with Bosch for 28nm fab in Germany
- Minima qualifies to join Arm Flexible Access Program to bring the Minima Chip to Life
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA