Report: TSMC's 3nm Fab Could Cost $20 Billion
EE Times
10/9/2017 03:01 PM EDT
TSMC announced last week it would locate what is the world's first announced 3nm fab in the Tianan Science Park in southern Taiwan, laying to rest speculation that TSMC might build the fab in the U.S. or elsewhere outside of Taiwan. TSMC did not give a timeframe for the fab's completetion, but has said in the past it would build a 5- or 3nm fab as early as 2022.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- TSMC to Build 3nm Fab in Tainan Science Park
- Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging
- ESMC Breaks Ground on Dresden Fab
- Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release