TSMC could partner with Bosch for 28nm fab in Germany
By Peter Clarke, eeNews Europe (April 14, 2023)
Lead foundry TSMC could partner with Robert Bosch and two other automotive suppliers to create a joint-venture 300mm fab in Germany that will target a 28nm process technology, according to reports in Digitimes.
A TSMC fab in Germany targeting a 28nm process is a less advanced development than previously expected – but also a more affordable one (see TSMC’s Dresden fab talks reach advanced stage, says report). While targeting 28nm could go some way to addressing security of automotive chip supply – an issue that got Germany’s attention during the pandemic crisis – it would do nothing for European strategic security and the region’s ability to manufacture at the leading-edge.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Bosch opens wafer fab of the future in Dresden
- GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing
- ESMC Breaks Ground on Dresden Fab
- SkyWater to Acquire Infineon’s Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release