TSMC could partner with Bosch for 28nm fab in Germany
By Peter Clarke, eeNews Europe (April 14, 2023)
Lead foundry TSMC could partner with Robert Bosch and two other automotive suppliers to create a joint-venture 300mm fab in Germany that will target a 28nm process technology, according to reports in Digitimes.
A TSMC fab in Germany targeting a 28nm process is a less advanced development than previously expected – but also a more affordable one (see TSMC’s Dresden fab talks reach advanced stage, says report). While targeting 28nm could go some way to addressing security of automotive chip supply – an issue that got Germany’s attention during the pandemic crisis – it would do nothing for European strategic security and the region’s ability to manufacture at the leading-edge.
To read the full article, click here
Related Semiconductor IP
- 1.6T Ultra Ethernet Controller
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
Related News
- Bosch opens wafer fab of the future in Dresden
- SkyWater to Acquire Infineon’s Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
- Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership
Latest News
- Imec unlocks fourfold UWB range extension using world-first narrowband receiver chip compliant with IEEE 802.15.4ab standard
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology