Tesla Considers Building ‘Tera Fab’ to Meet Future Chip Needs
By Nitin Dahad, EETimes | November 7, 2025
An upbeat Elon Musk, with his newly approved trillion-dollar pay package, talked to a very select group of investors at the Tesla annual shareholders meeting yesterday in Austin, Texas, and told the audience he had chips on his brain and planned to build a “Tera fab” that could potentially produce a million wafer starts per month to meet chip demand for Tesla alone.
Musk said that all he could think about was chips at the moment. He also said that with his AI5 chip and the planned AI6 chip, he did not think existing suppliers (TSMC and Samsung) could meet demand. As a result, he would consider some collaboration with Intel and also building Tesla’s own “Tera fab” to meet demand for Tesla’s own products.
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- Tera Systems' Tool Adopted by NEC Electronics for RTL Design Closure and Virtual Prototyping <!-- verification -->
- Chip Express, Lightspeed, Synplicity, and Tera Systems Team Up to Establish the “Structured ASIC Association”
- Teradici Licenses MIPS Technologies' Most Popular Embedded Processor for Innovative TERA Chipset in Datacenter-Based Computing
- VeriSilicon's Vivante VIP8000 Neural Network Processor IP Delivers Over 3 Tera MACs Per Second
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools