FinFETs Race Toward Silicon
100+ tapeouts so far include 16nm TSMC chips
Rick Merritt, EETimes
3/10/2015 01:30 PM EDT
SAN JOSE, Calif. — More than 100 chips in or headed for production have taped out using FinFET-based process technologies, according to EDA tool vendor Synopsys Inc. The chips include a quad ARM Cortex-A72 device made in TSMC’s 16nm process, it said.
Synopsys claims its Galaxy Design Platform has been used by 90 percent of the production-bound FinFET chips that have taped out to date. The news was released the same day archrival Cadence Design Systems announced Innovus, its next-generation physical design tool which claims significant speed ups in FinFET and planar processes.
The news suggests TSMC and Samsung are running neck-and-neck to close the gap with Intel which has been in production with 14nm processors for several months.
To read the full article, click here
Related Semiconductor IP
- CXL Controller With HPC Features (Spec Version 3.0 and Above)
- AP Memory VHM Controller
- High-performance, commercial-grade RISC-V CPU Core IP
- SWI3S Verification IP
- Secure Boot Loader
Related News
- ARC edges toward platform approach, profit
- Taiwan makes slow shift toward greater respect for IP
- Vulcan ASIC Ltd. rekindles Java core race with Moon IP
- Motorola and Altera Have Entered Discussions Toward an Embedded Processor Technology Licensing Agreement
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder