Ecosystem emerges around new mobile chip tech

George Leopold, EETimes
7/11/2012 12:15 PM EDT

SAN FRANCISCO – A consortium touting fully depleted silicon-on-insulator (FDSOI) technology for mobile computing applications presented a united front this week in promoting the process technology as a viable alternative to Intel’s FinFET manufacturing approach.

ARM, IBM, Soitec and STMicroelectronics along with foundry partner Globalfoundries and R&D organizations like CEA-Leti made their case for the FDSOI approach at the Semicon West conference here. They also stressed the need for “collaborative innovation” as new mobile technologies grow in complexity and cost. “The need to collaborate has never been more important,” said Gary Patton, vice president of IBM’s Semiconductor R&D Center.

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