Esperanto Pivots to HPC and Generative AI
By Sally Ward-Foxton, EETimes (August 22, 2023)
The company believes its chip is well-positioned to take advantage of the market for LLM inference today, Craig Cochran, a marketing executive at the Mountain View, Calif.-based company, told EE Times.
To read the full article, click here
Related Semiconductor IP
- GPU
- V-by-One Verification IP
- AI model compression IP
- Hardware compressed memory IP for CXL devices and chip-to-chip links
- Hardware link (de)compression IP for die-to-die, chip-to-chip, and DRAM interfaces
Related News
- Esperanto Technologies Announces RISC-V Industry Milestone Of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community
- Esperanto Technologies Introduces First Generative AI Appliance Based on RISC-V, Enabling Developers to Easily Create and Deploy Purpose-Built Vertical Applications
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- OPENEDGES Advances Commercialization of LPDDR6/5X Memory Subsystem IP, Targeting Next-Generation AI and HPC Markets
Latest News
- TSMC Boosts 2026 Expansion Budget, Adds $100B to U.S. Investment
- ZeroPoint Technologies Announces ZeroStream
- TSMC Reports Second Quarter EPS of NT$27.25
- Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design
- Defacto’s SoC Compiler Drastically Improved Productivity of L&T Semiconductor Technologies