Tensilica Enables Single Audio Core Blu-ray Disc Player SOCs; Will Demonstrate DTS-HD Master Audio on the HiFi 2 DSP at CES 2009
LAS VEGAS -- Jan. 7, 2009
-- Tensilica,® Inc. today announced that it will demonstrate DTS-HD Master Audio Lossless decoding on the HiFi 2 Audio DSP (digital signal processor), the industry’s lowest power, most area efficient audio processor core, at the Consumer Electronics Show in Las Vegas, January 8-11, 2009. The HiFi 2 DSP offers significant cost savings and a simplified programming model, as all Blu-ray audio processing can be done in one core, unlike other solutions that require two or more cores. Tensilica will have a private suite at the Las Vegas Convention Center, South Hall 3 (second floor), meeting place #35672MP. Reserve a meeting now by emailing meetings@tensilica.com.
Major semiconductor companies are already using the HiFi 2 Audio DSP for Blu-ray Disc SOCs (system-on-chips). Blu-ray Disc players require up to 7.1-channel audio, including Secondary Audio to support interactive content and directors commentary, higher resolution compressed audio streams for enhanced audio reproduction, and lossless audio format that provide bit-for-bit identical reproduction of the original studio master up to 7.1 channels.
New codecs have been developed and introduced by Dolby and DTS to support these audio capabilities, including Dolby Digital Plus, Dolby TrueHD, DTS-HD High Resolution Audio and DTS-HD Master Audio. Because of the higher complexity of these new codecs, plus support for simultaneous Secondary Audio decoding and mixing of primary and secondary audio and effects, there’s been a huge step function increase in audio signal processing requirements compared to the legacy DVD standard.
The HiFi 2 Audio DSP meets these processing challenges with extremely efficient implementations of all the mandatory and optional Dolby and DTS codecs. The worst case combination audio workload for a Blu-ray Disc player can run on a single HiFi2 DSP core in mainstream 65 nm processes. Other DSP core providers offer solutions that can only handle part of the entire Blu-ray workload in a single DSP core, thus SOCs must contain multiple cores from these other vendors – with increased cost of ten cents or more per chip plus added power consumption – to deliver a full Blu-ray solution.
About Tensilica
Tensilica, Inc., is the recognized leader in customizable dataplane processors. Dataplane Processor Units (DPUs) consist of performance intensive DSP (audio, video, imaging, and baseband signal processing) and embedded RISC processing functions (security, networking, and deeply embedded control). The automated design tools behind all of Tensilica’s application specific processor cores enable rapid customization to meet specific data-plane performance targets. Tensilica’s DSPs and processors power top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones, consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. For more information on Tensilica’s patented benchmark-proven DPUs visit www.tensilica.com.
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related News
- Tensilica's HiFi Audio DSP First IP Core to Achieve DTS-HD Master Audio Logo Certification
- Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs
- Cadence Tensilica HiFi Audio DSP is the First DSP IP Core to Support Dolby Atmos for PCs
- Cadence Introduces the Tensilica HiFi 5 DSP, the First DSP Optimized for AI Speech and Audio Processing
Latest News
- SkyeChip Berhad Delivers 35.0% Net Profit Growth Ahead of Main Market Debut on 20 May 2026
- Quantum eMotion and JMEM TEK Sign Consortium Agreement to Accelerate Quantum-Resilient Semiconductor SoC Development
- Silvaco Announces Immediate Availability of Mixel MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
- BrainChip Strikes IP Licensing Deal with ASICLAND
- Arteris Technology Adopted by Li Auto for Intelligent Vehicles