DMP 3D Graphics IP Core "PICA200 Lite" is adopted for OLYMPUS Tough TG-1
Tokyo, Japan– July 31st, 2012 – Digital Media Professionals Inc. (DMP), a leading provider of 2D/3D graphics Intellectual Property (IP) cores, today announced DMP 3D graphics IP core “PICA200 Lite” is adopted for OLYMPUS Tough TG-1 compact digital camera of Olympus Imaging Corporation.
PICA200 Lite is a 3D graphics IP core optimized for GUI (Graphical User Interface) application and based on OpenGL ES1.1 specification. PICA200 Lite provides the industry best performance vs. area vs. power consumption and the smallest silicon size.. In the Olympus TG-1 it is used for visualizing “A-GPS” and “E.COMPASS” which provides new user experiences in compact cameras.
“Our PICA200 Lite is adopted for OLYMPUS Tough TG-1, the latest compact digital camera of Olympus Imaging Corporation. It is the 5th model of deployment following the 4 micro four thirds models (OLYMPUS PEN E-3, E-PL3, E-PM1, OLYMPUS OM-D E-M5) which Olympus Imaging Corporation has deployed our graphics IP core.” said Tatsuo Yamamoto, CEO of DMP. “We are proud PICA200 Lite being adopted for their various product from a compact digital camera to the high-end micro four thirds model. We continue giving the most optimized graphics solution for embedded devices. ”
Related Semiconductor IP
- OpenGL ES 2.0 3D graphics IP core for FPGAs and ASICs
- High-performance and low-power 3D graphics IP core
- OpenGL® ES2.0 compatible 3D graphics IP core
- 2D (vector graphics) & 3D GPU IP A GPU IP combining 3D and 2D rendering features with high performance, low power consumption, and minimum CPU load
- Scalable 3D Graphics Accelerator
Related News
- DMP 3D Graphics IP Core "PICA200 Lite" is adopted for OLYMPUS PEN Lite E-PL5.OLYMPUS PEN mini E-PM2
- DMP 3D Graphics IP Core "SMAPH-S" is selected by Renesas Electronics
- Olympus adopts DMP's Hybrid Graphics IP core for OLYMPUS OM-D E-M1
- STMicroelectronics and Politecnico di Milano Build FASTER 3D Graphics Application using FPGAs
Latest News
- ASICLAND Selected as SK hynix’s Partner for Next-Gen eSSD Development, Establishing a ‘K-Semiconductor Win-Win’ Model
- onsemi to Acquire Synaptics to Enable the Next Generation of Intelligent Systems for Physical AI
- EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution
- Jim Keller: ‘AI Still Obeys the Old Laws of Compute’
- OpenAI and Broadcom unveil LLM-optimized inference chip