Vendor: Digital Media Professionals Inc. (DMP Inc.) Category: GPU

High-performance and low-power 3D graphics IP core

High-performance and low-power 3D graphics IP core for embedded devices.

Overview

High-performance and low-power 3D graphics IP core for embedded devices.
It has high computing performance required for advanced visual computing and high-performance graphics performance required for virtual reality (VR) and augmented reality (AR) applications.

Key features

  • M3000 series are 3D GPU IP cores that support OpenGL® ES3.0 adopting the DMP 3D graphics architecture “Musashi” and achieve the industry’s highest-level PPA (Power / Performance / Area).
  • With a configurable shader cluster architecture, the optimal GPU IP core configuration is provided according to customer’s requirements for performance and size.

Benefits

  • API: OpenGL® ES 3.0 / 2.0
  • Texture Format: OpenGL® ES supported format, ETC2, ASTC, YUV
  • Maximum Resolution: 4k x 2k
  • Memory BUS I/F: AXI 3 / 4
  • Configuration Register I/F: AXI 3 / 4、APB

Applications

  •  

Specifications

Identity

Part Number
M3000 Series
Vendor
Digital Media Professionals Inc. (DMP Inc.)
Type
Silicon IP

Videos

DMP ant200 demo with Macnica Helio SoC Evaluation Kit

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

Learn more about GPU IP core

A scalable, shader-programmable vector graphics GPU core for low-power MCUs

To meet the growing graphics demands, the industry is shifting toward scalable, shader programmable architectures. Unlike fixed-function graphics accelerators, shader programmable GPUs offer the flexibility required to target diverse market segments and at the same time ensure software portability and maintainability. Furthermore, adopting platform-independent stacks based on industry standards allows accelerating time-to market by developing applications on standard PC platforms before deployment to target hardware. TES Electronic Solutions in Germany addresses these challenges with the D/AVE NX GPU core. Engineered specifically for resource-constrained environments, it supports OpenGL ES 2.0 shader programmability with selected 3.x and vector graphics extensions.

Tape-out Risk in the Age of Edge AI: The Case for GPU IP

A full SoC tape-out at 5nm approaches $400M in fully loaded, non-recurring engineering and mask costs. At 3nm, estimates push past $600M. Every IP block on that die is a commitment to a set of assumptions about what the silicon will need to do. In AI, those assumptions have a shorter shelf life than they used to.

What Does a GPU Have to Do With Automotive Security?

The automotive industry is undergoing the most significant transformation since the advent of electronics in cars. Vehicles are becoming software-defined, connected, AI-driven, and continuously updated. This evolution brings extraordinary new capability – but it also brings greater levels of cybersecurity and functional-safety risks.

Frequently asked questions about GPU IP cores

What is High-performance and low-power 3D graphics IP core?

High-performance and low-power 3D graphics IP core is a GPU IP core from Digital Media Professionals Inc. (DMP Inc.) listed on Semi IP Hub.

How should engineers evaluate this GPU?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this GPU IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

×
Semiconductor IP