China to Write $10B Check for Chips
Rick Merritt, EETimes
1/14/2015 11:57 AM EST
HALF MOON BAY, Calif. — China is expected to invest this year half the $20 billion fund it set aside to grow its semiconductor industry. As much as 70% of it is expected to target its domestic wafer fabs.
The initiative is the latest of several failed attempts over the past 25 years to make China a significant producer of chips. This time around the government is taking a more market-oriented approach that will give it a better shot at success, said one executive bidding for as much as half the funds.
"It's not clear if the new scheme will work, but I think it's the right direction," said Simon Yang, chief executive of XMC, one of China's two 12-inch fabs that hopes to get as much as $10 billion
To read the full article, click here
Related Semiconductor IP
- Camera Post-Processing IP
- DC-DC Split-Pi Boost-Buck Converter
- Deep learning accelerator
- MIL-STD-1553 Controller IP
- UFS 5.x Device IP
Related News
- Sirius Wireless Launches Drone RF Transceiver IP to Address Growing Global Demand for UAV Communication Chips
- U.S. Passes CHIPS Act, Increasing Restrictions on China Lead to Rising Geopolitical Risk, Says Trendforce
- Joya Design Takes Neuromorphic Chip from Design to Device with First Innatera-Powered Consumer Audio Product at AWE China
- Safe and Secure Technologies, the new BSC and UPC spin-off that will design chips for critical sectors where “failure is not an option”
Latest News
- VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
- Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board