CEVA Confirmed As World's Leading Licensor Of DSP Intellectual Property

Leading Analyst Report Recognizes 40 Percent Annual Growth For CEVA DSP IP Business

SAN JOSE, Calif. - June 23, 2004 - CEVA, Inc. (NASDAQ: CEVA; LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores and communications solutions to the semiconductor industry, today announced it has extended its market leadership position as the number one licensor of DSP technology in the industry, as reported by industry analyst firm Gartner Dataquest. CEVA has experienced 40 percent year-on-year growth from 2002-2003 in revenues for its leading DSP technology, reinforcing its position as a driving force in the digital revolution.

Gartner Dataquest's report, "Market Share: Semiconductor Intellectual Property, Worldwide, 2003," indicated that in 2003 CEVA continued to dominate the DSP IP business with 63 percent worldwide market share. This is up 40 percent over 2002 revenue figures for CEVA's DSP business. ¹

CEVA's strong performance reflects the 25 licensee agreements completed by the company in 2003 with leading semiconductor and electronics systems customers including Broadcom Corporation, Infineon Technologies AG, Renesas Technology Corp., Samsung, STMicroelectronics and VIA Telecom, Inc. With more than 55 million DSP units shipped in 2003, CEVA estimates that more than $0.5 billion in revenue was generated from the sale of end products powered by CEVA DSP cores.

"Our relentless commitment to deliver industry leading complete end-to-end DSP solutions that power leading-edge technologies continues to drive sales," says Chet Silvestri, CEO, of CEVA, Inc. "We are very pleased with the Gartner Dataquest report, but we will not take our position for granted. CEVA is constantly evolving our DSP offering, adding System-on-Chip frameworks and solutions to ensure we meet our customers' ever-changing demands today and into the future."

CEVA DSP Cores

CEVA is the number one licensed DSP architecture in the semiconductor industry. Our offerings span from low-power DSP cores such as CEVA-TeakLite™ and CEVA-Teak™, established over the past 10 years, to high-performance architectures such as CEVA-Palm™ and the most recently launched architecture, the CEVA-X™. Each core delivers a different balance of performance, power consumption and cost, allowing customers to select a processor ideally suited to their target application. All are "soft cores" that can be manufactured by any process and are supported with a complete suite of Tools/Integrated Development Environment. CEVA DSP cores are also supported by a range of GPS, Bluetooth, multimedia, and VoIP application solutions.

About CEVA, Inc.

For more information about CEVA, Inc, visit the about section of our website.