Cadence Appoints Jan Willis Vice President of Strategic Third Party Programs; Willis to Lead Partnership Programs with EDA, IP, and Manufacturing Communities
San Jose, Calif., January 16, 2003 - Cadence Design Systems, Inc. (NYSE:CDN) today announced it has appointed Jan Willis vice president of Strategic Third Party Programs. Willis previously was vice president of DFM Third Party Programs at Cadence.
"Jan brings the expertise and leadership to optimize the design chain for our customers through world class relationships and partnerships," said Penny Herscher, executive vice president and chief marketing officer of Cadence. The appointment is a key element of Cadence's strategy to provide a complete solution to its electronic design customers. Willis is responsible for the company's role in the Open Access consortium, its partnerships with semiconductor manufacturers and IP vendors, its cooperative efforts with more than 120 companies in the Connections(R) program, and its relationships with foundries. Willis will report to Herscher.
Prior to Cadence, Willis was vice president of Business Development at Simplex Solutions, Inc. Before joining Simplex, she served as director of Product Marketing and the Semiconductor Vendor Program at Synopsys, Inc. Earlier, Willis held engineering and marketing positions at Hewlett-Packard Company.
Willis received a master's degree in business administration from Stanford and a bachelor's degree from the University of Missouri-Columbia, where she studied electrical engineering.
About Cadence
Cadence is the largest supplier of electronic design technologies, methodology services, and design services. Cadence solutions are used to accelerate and manage the design of semiconductors, computer systems, networking and telecommunications equipment, consumer electronics, and a variety of other electronics-based products. With approximately 5,200 employees and 2002 revenues of approximately $1.3 billion, Cadence has sales offices, design centers, and research facilities around the world. The company is headquartered in San Jose, Calif., and traded on the New York Stock Exchange under the symbol CDN. More information about the company, its products and services are available at www.cadence.com.
Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc.
Related Semiconductor IP
- Verification IP for MIPI SoundWire
- 100M/1G/ TSN Endpoint DO-254 IP Core
- Image Signal Processor
- H.265 / HEVC Video Codec
- H.264 / AVC Video Encoder
Related News
- Ceva Appoints Semiconductor Industry Veteran Ziv Hammer as Executive Vice President to Lead Connectivity & Sensing
- HAVi Announces New Members, Officers and Programs
- Programs seeks to boost over-the-Web core evaluation
- Artisan Components Appoints Senior Executive To Expand Strategic Customer Programs
Latest News
- Weebit Nano Q1 FY27 Activities Update
- INTERA Launches EAGLE Cognit, Bringing Ultra-Low-Power Near-Memory AI Acceleration to Next-Generation Edge Devices
- AeroTSN-EP in Action: SOC-E Brings Live Aerospace TSN Demonstration to A&D TSN Summit 2026
- Agnisys and Axiomise Collaborate to Accelerate NoC Design and Formal Sign-off
- TSMC Reports Third Quarter EPS of NT$29.43