Cadence CEO laments loss of VC in semis
SylvieBarak, EETimes
10/26/2011 2:24 PM EDT
SANTA CLARA, Calif.--Collaboration and more semiconductor VC investment is what’s needed to continue innovation in the hi-tech space, said Lip-Bu Tan, president and chief executive officer of Cadence Design Systems Inc., in a fireside chat with ARM’s executive vice Simon Seagers at TechCon.
With new technologies driving relationships between companies up and down the ecosystem, Tan--a longtime venture capitalist who remains chairman of Walden International, the VC fund he founded in 1989--agreed that collaboration had become an essential ingredient to product innovation, from startups to larger, more established companies.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Cadence to Acquire Hexagon’s Design & Engineering Business, Accelerating Expansion in Physical AI and System Design and Analysis
- Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification
- Cadence Completes Acquisition of Hexagon’s Design and Engineering Business, Advancing Leadership in Physical AI and Multiphysics
- IBM VC calls for 'open' hardware
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release