Battle looms for 'open' 3G basestation interface specs
Battle looms for 'open' 3G basestation interface specs
By John Walko, CommsDesign.com
June 20, 2003 (9:30 a.m. EST)
URL: http://www.eetimes.com/story/OEG20030619S0003
LONDON Nokia's attempts to form an open basestation architecture for next generation wireless networks were dealt a major blow this week when five other leading basestation makers agreed to cooperate on the creation of a common public radio interface (CPRI). Ericsson, Siemens, NEC, Nortel and Huawei Technologies are promoting the initiative to create an open-source definition for an interface between the control and radio elements of a basestation. They stress they are not trying to set a standard, but simply setting a common specification for this part of a basestation. The backers said the main benefits of such a move are faster development when introducing new technologies and allowing basestation manufacturers to offer a wider portfolio of products to operators with shorter time to market. This means operators will benefit from a broader choice of products and more flexible solutions, improving the efficiency of network deployment. < P> Nokia claimed similar advantages when it announced, at the February 2002 GSM World Congress, its Open Basestation Architecture Initiative. Companies working with Nokia on the initiative include LG Electronics and Samsung, but key players such as Ericsson and Siemens shied away from a full commitment to Nokia's initiative for an open interface specification. Others, including Nortel, said they are still in discussions with the Finnish group about their efforts. Those backing the CPRI initiative said it "complements current activities in existing standardization organizations (for example, 3GPP/3GPP2)." They also urged others to join the initiative, which plans to introduce products compatible with the specification next year.
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Intel joins CHIPS Alliance to promote Advanced Interface Bus (AIB) as an open standard
- Processor array alters approach to 3G basestations
- DSP manufacturers to take hard look at 3G requirements
- SiS changes tack for next round of graphics battle
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release