ARM rates FDSOI process as 'good technology'
Peter Clarke, EETimes
2/5/2013 11:30 AM EST
LONDON – Warren East, CEO of processor IP licensor ARM, says the company stands ready to help STMicroelectronics make a success of its fully-depleted silicon-on-insulator (FDSOI) chip manufacturing process, but that it is up to ST to make the process more widely available.
Speaking to EE Times in a discussion of ARM's 4Q12 and full year financial results East said of FDSOI: "We think it is pretty good technology and we would encourage ST to proliferate it. The physical IP we need to create is essentially the same [as for bulk CMOS]."
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- STMicroelectronics Secures Additional Sourcing for its Leading-Edge 28nm and 20nm FD-SOI Technology with GLOBALFOUNDRIES
- FDSOI roadmap renames next node as 14-nm
- Altera eyes FDSOI process for FPGAs
- ST-Ericsson opens the way for a new era of smartphones and announces the world's fastest, coolest integrated LTE Modem and Application Processor platform based on FD-SOI
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools