ARM and Cadence Tape Out First 14nm FinFET Test Chip Targeting Samsung Process
CAMBRIDGE, United Kingdom, and SAN JOSE, Calif., Dec. 20, 2012 - ARM (LON: ARM; Nasdaq: ARMH) and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the tape-out of the first 14-nanometer test chip implementation of the high-performance ARM Cortex-A7 processor, the most energy-efficient applications processor from ARM. Designed with a complete Cadence RTL-to-signoff flow, the chip is the first to target Samsungs 14-nanometer FinFET process, accelerating the continuing move to high-density, high-performance and ultra-low power SoCs for future smartphones, tablets and all other advanced mobile devices.
In addition to the ARM Cortex-A7 processor, the test chip includes ARM Artisan standard-cell libraries, next-generation memories, and general purpose IOs. The test chip was designed using a complete Cadence RTL-to-signoff flow including Encounter RTL Compiler, Encounter Test, Encounter Digital Implementation System, Cadence QRC Extraction, Encounter Timing System and Encounter Power System. This achievement is part of a systematic program to enable ARM technology-based SoCs on FinFET technology.
“This is an important milestone in our efforts to enable our silicon partners for continued low-power leadership in future generations of innovative, energy-efficient mobile products, said Dr. Dipesh Patel, vice president and general manager, Physical IP Division at ARM. Taping out ARMs most energy-efficient applications processor on Samsungs advanced low-power manufacturing process was achieved through the combination of leading-edge technology and R&D excellence, as well as a deep and early collaboration with Samsung and Cadence.”
“Cadences advanced node design flow, coupled with our collaboration with ARM and Samsung, is essential to semiconductor companies as they move to designing for a 14-nanometer FinFET process, said Dr. Chi-Ping Hsu, senior vice president, Research and Development, Silicon Realization Group at Cadence. Our common goal is to enable our customers to reap the benefits and competitive advantages of designing at the most advanced technologies.”
“End consumers are driving the need for better, faster, more connected devices, said Dr. Kyu-Myung Choi, senior vice president of System LSI infrastructure design center, Device Solutions, Samsung Electronics. Our collaboration with ARM and Cadence allows us to innovate quickly as Samsung develops this new process technology for mobile multimedia applications.”
About ARM
ARM designs the technology that is at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARMs comprehensive product offering includes RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the companys broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. Find out more about ARM by following these links:
- ARM website: http://www.arm.com
- ARM Connected Community®: http://www.arm.com/community
- ARM Blogs: http://blogs.arm.com
Related Semiconductor IP
- Dual Channel 8b D/A Converter - TSMC T40ULP
- Dual Channel 12b D/A Converter - TSMC T40ULP+ESF3
- 8bit D/A Converter - TSMC 22nm ULP
- 12bit 2MSps A/D Converter - TSMC T22ULP
- TSMC 2nm 1V2 GPIO
Related News
- Spectral introduces NeuralRAM, memory architectures in 14nm FinFET tech node targeted for a wide range of AI algorithms
- Cadence EMX 3D Planar Solver Certified for Samsung Foundry 8nm LPP Process Technology
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
- DEEPX Signs 2nm Process Agreement with Samsung Foundry to Develop World’s First On-Device Generative AI Chip ‘DX-M2’
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder