DoD may push back on Apple's P.A. Semi bid; PowerPC variant designed into many military systems
Rick Merritt, EE Times
(04/23/2008 2:48 PM EDT)
SAN JOSE, Calif. — Apple Inc. may have to face the ire of the U.S. Department of Defense following its planned acquisition of P.A. Semi Inc. The startup's PWRficient processor is designed into DoD programs in every major branch of the armed services, said one P.A. Semi customer who expects Apple will end production of the parts.
"We've had customers saying they are going to the DoD on this one," said a source in one of the several companies making embedded computer boards with the processor.
The source said he is aware of more than 10 defense systems using the PWRficient CPU, one of which recently forecasted it will use 70,000 of the chips over the next ten years. The board company alone forecast it would sell $100 million in products based on P.A. Semi chips over the next four years. Users include defense giants such as Lockheed Martin and Raytheon, the source said.
(04/23/2008 2:48 PM EDT)
SAN JOSE, Calif. — Apple Inc. may have to face the ire of the U.S. Department of Defense following its planned acquisition of P.A. Semi Inc. The startup's PWRficient processor is designed into DoD programs in every major branch of the armed services, said one P.A. Semi customer who expects Apple will end production of the parts.
"We've had customers saying they are going to the DoD on this one," said a source in one of the several companies making embedded computer boards with the processor.
The source said he is aware of more than 10 defense systems using the PWRficient CPU, one of which recently forecasted it will use 70,000 of the chips over the next ten years. The board company alone forecast it would sell $100 million in products based on P.A. Semi chips over the next four years. Users include defense giants such as Lockheed Martin and Raytheon, the source said.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- PA Semi, Apple "Interconnect" at Startup
- DARPA Selects Cerebras to Deliver Next Generation, Real-Time Compute Platform for Advanced Military and Commercial Applications
- Cadence Design Systems Agrees to Plead Guilty and Pay Over $140 Million for Unlawfully Exporting Semiconductor Design Tools to a Restricted PRC Military University
- Alphawave Semi Achieves 2025 TSMC OIP Partner of the Year Award for High-Speed SerDes IP
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers