TES Launches its µEngine: Parallel CPU System for Deterministic Real-Time HDL Applications
2026-02-23 13:27:00
IP Cores & Design
Semiconductor IP News Archive - Page 11 of 1948
PQShield becomes ST Authorized Partner
2026-02-23 12:36:36
Commercial Deals
sensiBel Licenses Sofics’ Advanced ESD Solutions for their Studio-quality MEMS Microphone Technology
2026-02-23 09:28:20
Commercial Deals
Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence Detection
2026-02-23 09:20:40
Commercial Deals
MIPI Specifications for Embedded Audio, Ambient AI, Smart Camera, IoT and Medical to be Featured at 2026 embedded world Exhibition & Conference
2026-02-23 07:12:01
Standards & Interconnects
M31 Validates MIPI M-PHY v5.0 IP on 4nm, Advances 3nm Development to Enable UFS 4.1 Applications
2026-02-23 06:30:00
IP Cores & Design
ASICLAND Partners with Daegu Metropolitan City to Advance Demonstration and Commercialization of Korean AI Semiconductors
2026-02-20 06:39:22
Commercial Deals
SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
2026-02-19 07:09:00
Commercial Deals
SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
2026-02-19 06:32:03
Commercial Deals
TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
2026-02-18 15:45:00
EDA & Design Tools
Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI
2026-02-18 14:22:00
Financials
QuickLogic Announces $13 Million Contract Award for its Strategic Radiation Hardened Program
2026-02-18 12:21:57
Commercial Deals
Cadence Reports Fourth Quarter and Fiscal Year 2025 Financial Results
2026-02-18 06:56:05
Financials
Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs
2026-02-18 06:41:02
SoC Architecture & Assembly
RaiderChip showcases the evolution of its local Generative AI processor at ISE 2026
2026-02-17 15:55:00
IP Cores & Design
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design
2026-02-17 15:23:00
Financials
Avery Dennison announces first-to-market integration of Pragmatic Semiconductor’s chip on a mass scale
2026-02-17 13:32:00
Manufacturing & Yield
Ceva, Inc. Announces Fourth Quarter and Full Year 2025 Financial Results
2026-02-17 13:11:13
Financials
Ceva Highlights Breakthrough Year for AI Licensing and Physical AI Adoption in 2025
2026-02-17 13:05:32
IP Cores & Design
Imec unveils 7‑bit, 175GS/s massively time-interleaved slope-ADC – pairing record-small footprint and low conversion energy with top sampling speed
2026-02-17 12:58:20
IP Cores & Design