BrainChip Names Former Arm Executive Nandan Nayampally as Chief Marketing Officer
2022-11-21 08:47:00
People & Leadership
Semiconductor IP News Archive - Page 231 of 1970
Embrace the new age of ultra-high-definition multimedia with HDMI 2.0 Rx PHY IP Cores in 12FFC process technology with matching controller
2022-11-21 01:25:00
Misc
Synopsys Wins Six Partner of the Year Awards at TSMC 2022 OIP Ecosystem Forum
2022-11-18 15:36:00
Misc
Stellantis Accelerates Autonomous Driving Journey with Acquisition of aiMotive, a Leading Artificial Intelligence and Autonomous Driving Start-up
2022-11-17 16:47:00
Strategic Partnerships
Truechip Announces First Customer Shipment of MIPI A-PHY Verification IP
2022-11-17 16:47:00
Verification IP
Alphawave IP announced as one of Deloitte's Technology Fast 50™ and North American Technology Fast 500™ 2022 award winners
2022-11-17 16:46:00
Misc
Vidatronic Named to the 18th Annual Aggie 100™, Honored as Fastest-Growing Company
2022-11-17 16:46:00
Misc
Secure-IC and Unseenlabs Partner to Retrofit Satellites already in Mission Mode with the Capability to Secure and Authenticate Data using Post-Quantum Cryptography
2022-11-17 15:20:00
Strategic Partnerships
intoPIX enables JPEG XS high frame rates real-time encoding from 120fps to more than 1000fps with the TicoXS FPGA IP-cores
2022-11-17 09:53:00
IP Cores & Design
Infineon plans €5bn 300mm fab in Dresden
2022-11-16 16:10:00
Analysis & Insight
intoPIX extends the FastTicoRAW SDK capabilities with lossless RAW coding for measurement and analysis
2022-11-16 07:39:00
SoC Architecture & Assembly
eMemory Collaborates with Renesas on the Development of its Pure 5V OTP IP Using 130nm BCD Plus Process for Automotive Applications
2022-11-16 07:36:00
Commercial Deals
Cadence Introduces Industry's Leading-Performance, Silicon-Proven 22Gbps GDDR6 IP at TSMC N5
2022-11-16 07:00:00
IP Cores & Design
Efinix Releases TinyML Platform for Highly Accelerated AI Workloads on Its Efficient FPGAs
2022-11-16 06:10:00
SoC Architecture & Assembly
Silicon Frontline Accepted as Partner in Samsung Foundry SAFE™ Program
2022-11-16 05:54:00
Misc
CAES GR712RC Microprocessor Selected by Argotec for Multiple Space Missions
2022-11-16 05:27:00
Commercial Deals
DSP Concepts and Analog Devices Collaborate on Solution for Rapid Design of In-Vehicle Audio Entertainment Systems
2022-11-16 05:21:00
SoC Architecture & Assembly
Small code, high performance: Latest IAR Embedded Workbench for RISC-V leverages CoDense™ from Andes
2022-11-16 03:13:00
SoC Architecture & Assembly
CEVA Introduces Voice User Interface Solution for TI SimpleLink™ Wi-Fi® Wireless MCUs
2022-11-15 13:46:00
SoC Architecture & Assembly
EASii IC announces first silicon for its DVB-S2X satellite Modem ASIC
2022-11-15 11:14:00
SoC Architecture & Assembly