Vidatronic Releases FlexSIMO™ DC-DC Converter Technology for Highly Efficient Power Delivery in IoT, AR/VR, and Metaverse SoCs
2022-10-28 08:33:00
IP Cores & Design
Semiconductor IP News Archive - Page 229 of 1964
Report: TSMC stops work on Chinese AI chip amid sanctions confusion
2022-10-27 16:50:00
Analysis & Insight
TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
2022-10-27 16:49:00
Foundries & Process Nodes
Siemens partners with TSMC for 3nm product certifications and other technology milestones
2022-10-27 16:48:00
EDA & Design Tools
Blueshift Memory Awarded Innovate UK Smart Grant to Develop AI Computer Vision Module
2022-10-27 16:48:00
Strategic Partnerships
Synopsys, Ansys and Keysight Accelerate 5G/6G SoC Designs with New mmWave Reference Flow for TSMC Process Technology
2022-10-27 16:47:00
EDA & Design Tools
Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC's Advanced Technologies
2022-10-27 16:47:00
EDA & Design Tools
Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow
2022-10-27 16:47:00
EDA & Design Tools
Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings
2022-10-27 16:47:00
EDA & Design Tools
SiMa.ai Welcomes New Investor MSD Partners Bringing Total Investment to $187 Million - SiMa.ai extends oversubscribed series B1 funding to $67 Million
2022-10-27 16:47:00
Strategic Partnerships
Zynq® UltraScale+™ MPSoC FPGA: REFLEX CES adds a new FPGA version to its Zeus Zynq® UltraScale+™ MPSoC System-on-module
2022-10-27 16:47:00
SoC Architecture & Assembly
Weebit Nano successfully qualifies its ReRAM module
2022-10-27 16:47:00
IP Cores & Design
Cadence's New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies
2022-10-27 10:00:00
EDA & Design Tools
GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring
2022-10-27 08:56:00
Commercial Deals
Flex Logix EFLX4K eFPGA IP Core on TSMC 7nm Technology Now Available
2022-10-26 14:08:00
IP Cores & Design
GUC Unveils GLink 2.3LL, The World's Most Powerful D2D Interconnect IP Using 2.5D Technology
2022-10-26 12:33:00
IP Cores & Design
Worldwide Silicon Wafer Shipments Set a New Record in Q3 2022, SEMI Reports
2022-10-26 08:58:00
Analysis & Insight
More than 50 members join SOAFEE to enable the software-defined vehicle of the future
2022-10-26 08:38:00
Misc
Cadence Digital and Custom/Analog Design Flows Achieve Certification for TSMC's Latest N4P and N3E Processes
2022-10-26 07:55:00
EDA & Design Tools
Avery Continues to Drive CXL Adoption with New Virtual Platform Features in Support of Version 3.0
2022-10-25 14:49:00
Verification IP