Silicon Frontline Accepted as Partner in Samsung Foundry SAFE™ Program
2022-11-16 05:54:00
Misc
Semiconductor IP News Archive - Page 225 of 1964
CAES GR712RC Microprocessor Selected by Argotec for Multiple Space Missions
2022-11-16 05:27:00
Commercial Deals
DSP Concepts and Analog Devices Collaborate on Solution for Rapid Design of In-Vehicle Audio Entertainment Systems
2022-11-16 05:21:00
SoC Architecture & Assembly
Small code, high performance: Latest IAR Embedded Workbench for RISC-V leverages CoDense™ from Andes
2022-11-16 03:13:00
SoC Architecture & Assembly
CEVA Introduces Voice User Interface Solution for TI SimpleLink™ Wi-Fi® Wireless MCUs
2022-11-15 13:46:00
SoC Architecture & Assembly
EASii IC announces first silicon for its DVB-S2X satellite Modem ASIC
2022-11-15 11:14:00
SoC Architecture & Assembly
TSMC Expansion in Arizona to Target 3-nm Node
2022-11-15 10:14:00
Analysis & Insight
StarFive Releases StarFive StarStudio IDE, which supports both Linux and Baremetal Development
2022-11-15 08:38:00
SoC Architecture & Assembly
Consortium forms Rapidus to get Japan back into chip race at 2nm
2022-11-14 14:30:00
Analysis & Insight
Nexperia invests in sustainable alternatives to batteries by acquiring Delft-based Nowi
2022-11-14 13:56:00
Strategic Partnerships
Arasan announces MIPI CSI IP for FPGA supporting full C-PHY 2.0 speeds
2022-11-14 13:40:00
IP Cores & Design
Ultra-high-speed 14-bit at 4.32Gbps ADC IP Cores are available for licensing, with increased accuracy and high sampling rate for a variety of applications
2022-11-14 12:10:00
Misc
ZeroPoint Technologies can reduce data center energy consumption by 25%
2022-11-14 09:16:00
IP Cores & Design
JEDEC Announces Publication of the SPD5118 Hub and Serial Presence Detect Device and the DDR5 SPD Contents Specifications
2022-11-14 04:01:00
Misc
SiPearl and AMD collaborate to address exascale supercomputing in Europe
2022-11-14 03:51:00
Strategic Partnerships
Marvell Announces Innovative CXL Development Platform for Multi-Host Memory Pooling
2022-11-14 03:32:00
SoC Architecture & Assembly
QuickLogic Inks eFPGA Sales Rep Agreement with CHIP-gogo in Japan
2022-11-14 02:11:00
Misc
Signing of a Large Contract with an Industry Leader for Kalray's DPU Processor
2022-11-14 01:38:00
Strategic Partnerships
Fraunhofer IPMS combines latest hardware in microsensor and actuator technology with artificial intelligence
2022-11-14 01:02:00
Misc
Arm technology is defining the future of computing: Record royalties highlight increasing diversity of products and market segment growth
2022-11-11 11:18:00
Financials