3D ICs without TSVs?

Ron Wilson, EETimes
8/30/2011 8:46 PM EDT

Two assumptions have become accepted truths in SoC planning: first, that the way forward involves 3DICs; and second, that 3DICs require through-silicon vias (TSVs.) One result has been a tremendous focus on the challenges of TSVs, and a growing realization of just how formidable those problems really will be in production. But what if the first assumption is true and the second one is false? One of the hottest water-cooler topics at Semicon West this year was a PowerPoint pitch from a new venture called MonolithIC 3D. In it, the company argued exactly this point.

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