300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports
MILPITAS, Calif. — September 3, 2019 — 300mm fab equipment spending will slowly recover in 2020 after the 2019 downturn and take off in 2021 to log a new record high topping US$60 billion, only to lag again in 2022 and rebound to an all-time peak in 2023, according to the SEMI Industry Research and Statistics group in its first edition of the 300mm Fab Outlook report.
Most of the surges in fab equipment investment over the five-year outlook will be driven by memory (primarily NAND), foundry/logic, and power. Korea will head the list of top-spending regions followed by Taiwan and China, though Europe/Mideast and Southeast Asia are also expected to show healthy increases between 2019 and 2023.
Offering projections through 2023, the 300mm Fab Outlook report details fab investments across construction and equipment, as well as fab capacities and technologies investment for DRAM, NAND, foundry, logic, and a host of other products manufactured on 300mm wafers.
Fab equipment spending and volume fabs/lines count 2012-2023 and high-probability fab projects
The number of semiconductor fabs/lines in operation is expected to jump more than 30 percent, from 136 in 2019 to 172 in 2023, and climb even higher, to nearly 200, when lower probability fabs/lines are included in the count.
The new SEMI 300mm Fab Outlook report shows facility details by quarter through 2023 and also includes projections for fab projects through 2030 with estimates of various probabilities.
To learn more about the SEMI 300mm Fab Outlook report, click here.
About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports
- 300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027, SEMI Reports
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
- Fab Equipment Spending Breaking Industry Records
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers