3-D integration takes spotlight at ISPD
R Colin Johnson, EETimes
3/26/2013 11:57 AM EDT
Keynoting the 3-D track was veteran chip architect Liam Madden, vice president of FPGA development at Xilinx Inc. (San Jose, Calif.) who claimed that chip designers can have their 3-D cake and eat it, too.
To read the full article, click here
Related Semiconductor IP
- Xilinx Virtual Cable
- 25 Gb/s AES-ECB 128/192/256 Crypto Cores
- Xilinx HMC Controller
- Xilinx MicroBlaze Trace Core (XMTC)
- Xilinx Ultra Scale Plus SATA HOST IP
Related News
- Synopsys 3DIC Compiler Qualified for Samsung Foundry's Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs
- InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration
- Xilinx Ships World's First Heterogeneous 3D FPGA
- SENSIO 3D Decoder integrated in Christie SKA-3D processor
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder