TSMC bags up Apple for 2020
January 6, 2020
TSMC will remain the sole foundry partner of Apple for the chips for its 2020 iPhone series, reports the Chinese-language Commercial Times.
The chips will be made on TSMC’s 5nm EUV process and production starts in Q2 2020.
To read the full article, click here
Related Semiconductor IP
- Over-Voltage Lockout (OVLO) IP
- Verification IP for Universal Chiplet Interconnect Express (UCIe) up to 3.0
- UCIe-S (Gen2) Compatible PHY for Standard Package (x16) in TSMC N3P, North/South Orientation
- DSP-Based 112G SerDes
- XTAL oscillator in TSMC-7nm
Related Blogs
- TSMC Gets 28nm Yield Up Over 80%
- Did Qualcomm and Apple Attempt to Bribe TSMC?
- TSMC Apple Rumors Debunked!
- TSMC To Tape-Out 20nm Apple Processor This Month
Latest Blogs
- M31 High-Speed and Long-Channel MIPI C/D-PHY Solution on TSMC N3P/N3C
- Understanding security certification and how analog IP can help
- Embedded Security explained: Secure boot for embedded systems
- World's First Standards-Compliant 112G PHY IP for Linear Optics: A Turning Point for AI Interconnects
- One Key for Every Door: How Aliro Extends the UWB Digital Key Beyond the Car